BS EN 205:2016 pdf free.Adhesives- Wood adhesivesfor non-structural applications—Determination of tensileshear strength of lap joints.
BS EN 205 lt is permissible to prepare panels from different boards unless it is essential to minimize differences inthe wood in order to conduct special comparative tests.
Ensure that the angle between the growth rings and the surface to be bonded is between 30° and 90°.Cut the panels across the direction of the grain to a length equal to a multiple of 300 mm with thenecessary allowance for cross-cutting and along the grain to a width of approximately 130 mm makingan allowance for the width of cut as shown in Figure 1.
For tests use two panels of (5,0 ±0,1) mm thickness.
For conventional tests, condition the panels at a temperature of either (20 ±2)C and (65±5) %relative humidity or (23±2) C and(50 ± 5) % relative humidity subsequently referred to as thestandard atmosphere (20/65) or (23/50) for a minimum of 7 days.
Prepare bonded assemblies using thin (approximately 0,1 mm) bond-lines. Not more than 24 h beforebonding, either lightly plane or lightly sand each surface to be bonded (using an abrasive paper of grainsize P100 complying with ISO 6344-2:1998 is recommended). Remove any dust carefully. Do not touchor soil the prepared surfaces.
Comply with the adhesive manufacturer’s instructions regarding the processing conditions,includingthe preparation of the adhesive, the amount of adhesive to be applied, whether the adhesive is to beapplied on one or both surfaces, the open and closed assembly time and the magnitude and duration ofthe assembly pressure and report them in the test report.
After pressing condition the assembly for 7 days in standard atmosphere.
A longer conditioning time may be used if recommended by the adhesive manufacturer.The test pieces shall not be cut earlier than 5 days after bonding.
Cut five strips of width b=(20± 0,2) mm from each bonded assembly along the grain, avoiding areaswithin 7,5 mm of the outside long edges of the panel as shown in Figure 1.Cut these strips into testpieces of length l= (150± 5) mm as shown in Figure 2.
Make flat bottomed cuts of (2,5±0,5) mm wide in the bonded sections across the grain so that anoverlap of length lz =(10,0±0,2) mm is defined in the middle section (see Figure 2). The cuts are toseparate the wood layers. Take care that the cuts completely cut through the bond line but onlypenetrate as little as possible into the other part of the joint.BS EN 205 pdf download.